Microsystems Office Wide BAA

The Department of Defense (DoD), Defense Advanced Research Projects Agency (DARPA), Microsystems Technology Office (MTO), has a Microsystems Technology Office (MTO) Office-wide BAA.

Solicitation Summary

The Department of Defense (DoD), Defense Advanced Research Projects Agency (DARPA), Microsystems Technology Office (MTO), has a Microsystems Technology Office (MTO) Office-wide BAA.

Solicitation in a Nutshell

Item

Details
Agency Department of Defense (DoD), Defense Advanced Research Projects Agency (DARPA), Microsystems Technology Office (MTO)
Solicitation Number HR001124S0028
Status Post-RFP
Solicitation Date 05/09/2024
Award Date 10/2025 (Estimate)
Contract Ceiling Value  To Be Determined
Competition Type  Full and Open / Unrestricted
Type of Award  Other Transaction Agreement
Primary Requirement  Research & Development
Duration  4 month(s) base plus 1 x 8 month(s) option(s)
Contract Type  Other Transaction Agreement
No. of Expected Awards  Multiple – Number Unknown
NAICS Code(s):
541715

Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
Size Standard: 1000 Employees except 1500 Employees for Aircraft, Aircraft Engine and Engine Parts, 1250 Employees for Other Aircraft Parts and Auxiliary Equipment and 1300 Employees for Guided Missiles and Space Vehicles, Their Propulsion Units and Propulsion Parts

541713

Research and Development in Nanotechnology
Size Standard: 1000 Employees
Place of Performance:
  • United States
Opportunity Website: https://sam.gov/opp/b2507ad585714764b454127163debc88/view

Background

N/A

Requirements

Research areas of current interest to MTO include, but are not limited to, the following topics:

  • Quantum circuits
    • Fault-tolerant quantum computer modeling
    • Fault-tolerant quantum computer architectures
    • High efficiency quantum-optical transducers
    • High-rate quantum-optical entanglement generators
    • Matrixed quantum sensors for sensing and signal processing
    • Methodologies and building blocks for chip-scale quantum systems
    • Scalable application-specific quantum hardware
    • Ultrahigh density qubit manufacturing methods
  • Biological circuits
    • Biochemical processor alternatives
    • Microsystem translators to control biological function
    • Portable, customizable nanopore sensing platforms
    • Self-assembled biomolecular transistors and integrated circuits
  • Photonic circuits
    • Chip-scale hyperspectral sensors
    • Low size, weight, and power conformal optical phased arrays
    • Low size, weight, and power high intensity light sources
    • Portable ultrahigh power terahertz emitters
    • Ultrafast scattered light analyzers
    • Ultrahigh-density intra-chip 3D photonic interconnects
  • Manufacturing Ecosystem
    • Data-starved fabrication and integration process predictions
    • Frameworks to accelerate electromagnetic microsystem discovery
    • High density cryogenic-to-room-temperature interconnects
    • Miniaturized 3D heterogeneously integrated cryogenic cooling
    • Real-time closed-loop manufacturing of new materials
    • Self-updating programmable assembly tools
  • Dual Use by Design
    • Black-box model-based risk assessment frameworks
    • Commercially relevant tool development challenge problems
    • Customizable template application specific integrated circuits
    • Electromagnetic spectrum interaction strategic emulators
    • High-accuracy long range passive ranging
    • High-efficiency waste heat electricity generation at the microsystem
    • Low size, weight, and power passive navigation
    • Plasmonic sub-terahertz amplifiers
    • Tunable emissivity materials

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